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Transys Company Information

Transys Electronics Ltd is a family owned semiconductor manufacturer located in the industrial heartland of Birmingham, UK.  Founded in 1992, Transys now owns and operates a full capability 4000 square foot power semiconductor waferfab along with substantial assembly capability.

Our products operate in the advanced specification arena, harsh applications, large area die or difficult electrical parameters have been the key to Transys's growth.

Considerable investment in both key personnel and equipment has kept Transys ahead of the technological curve, even in an industry that boasts much larger companies.  

Transys maintains a full 4000 square foot waferfab in their Birmingham headquarters.  Capable of 5,000 wafers 4 and 5 inch power semiconductor wafers per week.  The products range from Rectifier diodes including high voltage 2500 volts, SCR's including high voltage 2200 volts, gate sensitive Triac's 3/3/3/5, TVS diodes up to 500 volts in a single die, the Transhield TVS with zero slope resistance and the Telecom Sidac protector wafers including advanced specifications including the Bellcore1089.  

Transys operates an advanced system of Statistical process control (SPC) along with the ISO9001 quality system.

Transys has a full range of processing capability, Diffusion, Photolithography, chemical etch, an evaporated metal system and dicing all onsite in the UK.

The metal system allows great flexibility to deposit metals to suit various assembly operations.  Transys uses Chrome, Nickel and silver for solderable die and aluminium for wire bonding.  Transys also offers a hybrid solution for SCR and Triac die allowing the cathode to be solderable but the gate to have an aluminium surface.  The thickness of the metal can be adjusted to suit most requirements.

Due to advanced process control and low defect ratio Transys is able to manufacture very large area die at excellent yields.

Transys Packaging Solutions
As do most semiconductor companies, Transys subcontracts the assembly of our die to specialist partners at various locations in Asia.  Some of our customers however requires more.  We maintain a packaging solution division at our UK headquarters. 
This division uses exclusively vacuum soldering systems to attach die into power modules of various types and sizes.
Transys has full design capability to work with our customer to create the perfect solution to their needs. 
Our one shot vacuum soldering systems mean we can use any type of solder, lead based or Rohs approved in one soldering cycle.  Many companies solder the semiconductor die and Molybdenum at one time using vacuum soldering and then attach the Direct bonded copper in another process, normally inside an furnace.  Transys completes the whole process inside the vacuum system and using the same solder at one time.
Soldering directly to Aluminium heatsinks
Many power modules are attached directly onto an aluminium heatsink.
This process creates extra joints in the product and thus impedes heatflow from the die.
Transys has developed a process that allows for soldering directly onto the chosen aluminium heatsink.  This is completed inside the vacuum environment and at the same time as all of the other soldered joints.  This eliminates the need for the copper heatsink and improves the thermal conductivity considerably.

Логотип: Transys



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